Epo-Tek Ee129-4 Adhesive 1 oz

  • 7-10 days

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Product Overview
  • Epo-Tek® EE129-4 is a room temperature cure, silver-filled epoxy, designed for making electrical connection in SEM mounting sample, circuit assembly, semiconductor, LCD applications.
    Epo-Tek® EE129-4 comes with two parts: A & B and mixing ratio is 1:1. Shelf life is one year at room temperature

    Maximum Bond Line Cure Schedules:

    100°C 15 minutes
    80°C 1 hour
    70°C 2 hours
    23°C 24 hours

    Pot Life: 3 hours

    EPO-TEK129-4 Features:

    • Low temperature cures capable from 23°C to 80°C
    • Suggested for cryogenic cooling applications
    • Works well in SEM, microscopy applications
    • Works well in aerospace hybrid circuits and ITO electrodes in LCD packaging and assembly
    • Reasonable pot life of 3 hours, allows for preparation
    • Smooth thixotropic paste allows for many way of application

    Works well with surface like Au, Ag-Pd, Cu, brass, Kovar, stainless steel, as well as ceramic, PCB, solder masks, most plastic and glasses

    Typical properties: (to be used as a guide only, not a specification)

    Physical Properties:
    Color: Part A: silver; Part B: silver
    Consistency: Smooth, thixotropic – 4000 cPs
    Viscosity (@ 100 RPM / 23°C): 2,000-4,000 cPs
    Thixotropic Index: 4.6
    Glass Transition Temp (Tg): ≥45°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
    Coefficient of Thermal Expansion (CTE): Below Tg: 30 x 10-6 in/in/°C
    Above Tg: 227 x 10-6 in/in/°C
    Shore D hardness: 63
    Lap Shear Strength @ 23°C: 1,110 psi
    Die Shear Strength @ 23°C: ≥5 kg / 1,700 psi
    Degradation Temp (TGA): 303°C
    Weight Loss: @ 200°C: 0.18%
    @ 250°C: 0.54%
    @ 300°C 2.06%
    Operating Temp: Continuous: -55°C to 150°C
    Intermittent: -55°C to 250°C
    Storage Modulus @ 23°C: 156, 318 psi
    Ion: Cl- 223 ppm
    Na+ 26 ppm
    NH4+ 22 ppm
    K+ 12 ppm
    Particle Size: ≤45 microns
    Electrical Properties:
    Volume Resistivity @ 23°C: ≤0.0003 Ohm-cm
    Thermal Properties:
    Thermal Conductivity: 1.60 W/mK
Pack size
  • 1 oz
Material Safety Data Sheet (MSDS)

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